View BD9E151NUX_7771580.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

datashee t product structure silicon monolithic integrated circuit this product has not designed prot ection against radioactive rays . 1/19 tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.07.17 rev.001 tsz22111 ? 14? 001 www.rohm.com 6.0v 28v, 1.2a 1ch 1ch step-down switching regulator BD9E151NUX general description the BD9E151NUX is a 28v, 1.2a diode-rectification buck converter that integrat ed internal high-side 30v power mosfet. to increase efficiency at light loads, a pulse skipping is automatically activated. furthermore, the 0ua shutdown supply current allows the device to be used in battery powered application. current mode control with internal slope compensation simplifies the external component count while allowing the use of ceramic output capacitors. features high and wide input range (vin=6v~28v) 30v/80m internal power mosfet 600khz fixed operating frequency feedback pin voltage 1.0v1.0% internal over current p rotection(ocp), under voltage locked out(uvlo), over voltage protection(ovp), thermal shut down(tsd) 0a low shutdown supply current vson008x2030 package key specifications input voltage ref. precision (ta=25) max output current operating temperature operating juncti on temperature 628 [v] 1.0[%] 1.2 [a] (max.) -40~85 -55125 packages vson008x2030 2.00mm x3.00mm x 0.60mm applications surveillance camera applications oa applications 12v, 24v distributed power systems typical application circuits structuresilicon monolithic integrated circuit this product is not designed for normal oper ation within a radioactive figure 1. typical application circuit vson008x2030 http://
2/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 pin configuration pin description pin no. pin name description 1 bst the pin is power supply for float ing power nmos driver. connect bypass capacitor between the pin and lx pin fo r bootstrap operation. 2 vin input supply. place bypass capacitor as close as possible to this pin. 3 en enable input pin. apply more than 2.4v to start-up the dcdc. th is pin is pulled down by 700k, apply less than 0.8v or open to shutdow n the dcdc. 4 ss soft start pin. an external capacitor connected to this pi n sets output rise time. 5 fb inverting node of the gm amplifier. 6 vc error amplifier output, and inp ut to the pwm co mparator. connec t phase compensation components to this pin. 7 gnd ground. 6 lx place schottky barrier dio de as close as possible and indu ctor to this pin. - back side pad pad for radiation of heat. connect to gnd is recommended. block diagram figure 2. pin configuration (top view) figure 3. block diagram http://
3/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 description of blocks 1. reference this block generates reference volt age and current. it start op eration by applying en=h. it provides reference voltage and current to error amplifier, o scillator, and etc. 2. reg this is a gate drive voltage generator and 5.5v regulator for i nternal circuit power supply. 3. osc this is a precise wave oscillat ion circuit with operation frequ ency fixed to 600 khz 4. soft start this block does soft start to t he output voltage of dc/dc conve rter, and prevents in-rush current during start-up. soft start time set by the capaci tor connected to ss pin and ss charge current is the time from en pin start-up to reaching to 1.0v. 5. error amp this is an error amplifier that detects output signal, and outp uts pwm control signal. inter nal reference vo ltage is set to 1.0v. connect phase compensat ion components between this pin and ground (ref. p.11). 6. ovp the ovp circuit includes an overvoltage comparator to compa re the fb pin voltage and internal thresholds. when the fb pin voltage goes above 110%fb, the high-side m osfet will be forced off. when th e fb pin voltage falls below 105%, the high-side mosfet will be enabled again. 7. icomp the BD9E151NUX implements current mode control that uses the vc pin voltage to turn off the high-side mosfet on a cycle by cycle basis. every cycl e the switch current and the co mp pin voltage are compared; when the peak inductor current intersects the vc pin vol tage, the high-side switch is turned off. during overcurrent c onditions that pull the output voltage low, the error amplifier responds b y driving the comp p in high, causing the swit ch current to increase. 8. ocp this is a circuit to protect the high-side fet from overcurrent . every cycle the switch curr ent and the reference voltage of overcurrent protection are co mpared; when the peak inductor current intersects the refer ence voltage, the high-side switch is turned off. once overcurrent is detected, the device will stop and vc pin voltage will be reset and ss pin voltage will be discharged by 2ua (hiccup operation). then ss p in voltage reaches to less than 0.1v, ic will restart. 9. high-side mosfet this is a 30v/80m high-side mosf et that converts inductor curr ent of dc/dc converter. because the current limiting of this fet i s 1.6a included ripple current, please us e at within1.6a. 10. uvlo this is a low voltage e rror prevention circuit. this prevents internal circuit error during increase of power s upply voltage and during decline of power supply voltage. it monitors vin pin voltage and internal reg voltage, and when vin voltage becomes 5.2v and below, it turns off all output fet and turns off dc/dc co mparator output and soft start circuit resets. now this t hreshold has hysteresis of 200mv. 11. tsd this is a heat protect circuit. when it detects an abnormal temper ature exceeding maximum junct ion temperature (tj=150), it turns off all output fet, and turns off dc/dc converte r output. when temperature fal ls, it automatically returns. 12. en when a voltage of 2.4v or more is applied, it tu rns on, at open or 0v application, it turns off. about 700k pull-down resistanc e is contained within the pin. http://
4/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 absolute maximum ratings item symbol ratings unit vin to gnd vin 30 v bst to gnd vbst 37 v bst to lx Svbst 7 v en to gnd ven 30 v lx to gnd vlx 30 v fb to gnd vfb 7 v vc to gnd vss 7 v ss to gnd vss 7 v high-side fet drain current idh 1.6 a power dissipation pd 2 (*1) w operating temperat ure topr -40+85 storage temperature tstg -55+125 junction temperature tjmax 150 (*1)during mounting of 70701.6 t mm 4layer board.reduce by 20mw fo r every 1 increase. (above 2 5) operating ratings item symbol ratings unit min typ max input voltage vin 6 - 28 v output voltage vout 1.0 (*2) - vinx0.7 or vin-5 v output current iout - - 1.2 a (*2)restricted by minimu m on pulse typ. 100nsec http://
5/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 electrical characteristics ( unless otherwise specified ta=25, vin=12v, vout=5v ) not designed to withstand radiation. parameter symbol limits unit conditions min. typ. max circuit current stand-by current of vin ist 0 10 ua ven=0 circuit current of vin icc 0.8 1.6 ma fb=1.5v under voltage lock out (uvlo) reset threshold voltage vuv 5.0 5.4 5.8 v vin rising hysteresis width vuvhy 200 400 mv oscillator oscillating frequency fsw 540 600 660 khz max duty cycle dmax 85 91 - % error amplifier fb threshold voltage vfb 0.990 1.000 1.010 v input bias current ifb -1.0 0 1.0 ua vfb=0v error amplifier dc gain a vea - 600 6000 v/v error amplifier transconductance g ea - 250 500 ua/v ivc=10ua,vc=1.0v current sense amplifier vc to switch current transconductance cs - 10 20 a/v output high-side mosfet on resistance ronh 80 160 m over current detect current iocp 1.6 2.2 a ctl en pin control voltage on ven 2.4 vin v ta=-40~85 vin=6~28v off venoff -0.3 0.8 v en pin input current ren 6 .0 7.0 15.0 ua ven=5v soft start charge current iss 1 2 4 ua http://
6/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 t=-60c t=105c t=25c t=150c t=-60c t=105c t=25c t=150c typical performance characteristics (unless otherwise specified, ta=25, vcc=12v, vo=5v,) figure 4. operating cu rrent - input voltage figure 5. operating cu rrent - temperature figure 6. uvlo threshold - temperature fi gure 7. switching frequency - temperature figure 8. max duty - temperature figure 9. fb pin reference voltage ? input voltage 0.0 0.4 0.8 1.2 1.6 2.0 7 10131619222528 vin [v] icc [ma] 530 550 570 590 610 630 -40 -15 10 35 60 85 ta [c] fosc [khz] 80.0 84.0 88.0 92.0 96.0 100.0 -40 -15 10 35 60 85 ta [c] duty [%] 0.990 0.992 0.994 0.996 0.998 1.000 1.002 1.004 1.006 1.008 1.010 7 10131619222528 vin [v] fb threshold [v] +vth -vth 4.0 4.4 4.8 5.2 5.6 6.0 -40 -15 10 35 60 85 ta [c] vcc uvlo threshold [v] 0.0 0.4 0.8 1.2 1.6 2.0 -40 -15 10 35 60 85 ta [c] icc [ma] vin=7v vin=12v te m p = - 4 0 te m p = 2 5 te m p = 8 5 detect voltage reset voltage vin=24v http://
7/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 vcc=6v vcc=12v vcc=18v vcc-24v vcc=30v vcc=12v vcc=18v vcc=24v t=-60c t=25c t=105c t=150c 50.0 65.0 80.0 95.0 110.0 125.0 -40 -15 10 35 60 85 ta [c] ron [m ? ] figure 10. fb pin reference voltage - temperature figure 11. fb pin voltage ? vc pin current figure 12. ss pin charge current - temperature figure 13. high-side fet ron - temperature figure 14. ocp detect current - temperature figure 15. en threshold voltage - temperature -60.0 -40.0 -20.0 0.0 20.0 40.0 60.0 00.40.81.21.62 vfb [v] ivc [ua] 1.0 1.1 1.2 1.3 1.4 1.5 -40 -15 10 35 60 85 ta [c] en threshold [v] 0.0 0.8 1.6 2.4 3.2 4.0 -40 -15 10 35 60 85 ta [c] iss [ua] 0.0 0.8 1.6 2.4 3.2 4.0 -40 -15 10 35 60 85 ta [c] ocp threshold[a] te m p = - 4 0 ` te m p = 2 5 ` te m p = 8 5 ` 0.990 0.992 0.994 0.996 0.998 1.000 1.002 1.004 1.006 1.008 1.010 -40 -15 10 35 60 85 ta [c] fb threshold [v] http://
8/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 reference characteristics of t ypical applica tion circuits (vin=12v, vout=5v iout=1a) figure 17. efficiency - output current figure 18. efficiency - input voltage figure 19. start-up characteristics figure 20. load response 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 output current io[m a] efficiency [%] vin=8v vin=12v vin=25v 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 output current io[m a] efficiency [%] iout=100ma iout=10ma iout=1a en [10v/div] lx [10v/div] vout [2v/div] iout [0.2a/div] 10ms/div iout [1a/div] vout [0.1v/div] 10ms/div overshoot=134mv undershoot=152mv (back side pad is recommended connecting to gnd) figure 16. typical applicationcircuit (vou=5v) vin bst en ss lx gnd vc fb css:0.047uf en ss vin vout d1 rsx101va-30(rohm) nrs6045t 15uh (taiyo yuden) 47uf/16v grm32eb31c476ke15l (murata) co1 c bst :0.1uf c1:10000pf r3:2.7k cvcc2 10uf/35v grm31cb3ya106ka12l(murata) r4:12k r5:3k ro:1k ( ) http://
9/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 figure 21. lx switching/ vout ripple io = 100ma figure 23. frequency response io=1a figure 22. lx switching/ vout ripple io=1a vout [20mv/div] vripple=25.0mv phase gain vout [20mv/div] vripple=15.0mv http://
10/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 application parts list 1 (vin=12v, vout=5v iout=1a) symbol value part name company comments [capacitor] cvcc 10uf/35v crm31cb3ya106ka12l murata css 0.047uf/25v grm155b31e473ka87 murata c1 10000pf/50v grm155b31h103ka88 murata cbst 0.1uf/10v grm155b31c104ka87 murata co 47uf/16v grm32eb31c476ke15l murata [resistor] r3 2.7k mcr03 series rohm r4 12k mcr03 series rohm r5 3k mcr03 series rohm [diode] d0 - rsx101va-30 rohm [inductor] l0 15uh nrs6045t150 taiyo yuden application parts list 2 (when load current are light and make a point of total area) (vin=12v, vout=5v, iout=300ma) symbol value part name company comments [capacitor] cvcc 10uf/25v grm188r61e106ma73 murata css 0.047uf/25v grm155b31e473ka87 murata c1 22000pf/50v grm155b31h223ka12 murata cbst 0.1uf/10v grm155b31c104ka87 murata co 22uf/10v grm21bb31a226me51 murata [resistor] r3 2.2k mcr006 series rohm r4 12k mcr006 series rohm r5 3k mcr006 series rohm [diode] d0 - rsx101va-30 rohm [inductor] l0 15uh dem3518c series toko http://
11/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 application components selection method (1) inductors something of the shie ld type that fulfills the current rating ( current value ipecac below), with low dcr is recommended. value of inductance influences inductor ripple curren t and becomes the caus e of output ripple. in the same way as t he formula below, this r ipple current can b e made small for as big as the l value of co il or as high as the switching f requency. (Sil: output ripple current, vin : input voltage, vout: output v oltage, f: switching frequency) for design value of inductor ripple current, please carry out d esign tentatively with about 20%50% of maximum input current (2) output capacitor in order for capacitor to be used in output to reduce output ri pple, low ceramic capacitor of esr is recommended. also, for capacitor rating, on top of putting into consideratio n dc bias characteristics, please use something whose maximum rating has sufficient margin with respect to the output voltage. output ripple voltage is looked for using the following formula. the actual value of the output capacitor is not critical, but some practical limits do exist. consider the relationship between the crossover frequency of the design and lc corner frequency of the out put filter. in general, it is desirable to keep the crossover frequency at less than 1/5 of t he switching frequency. with high switching frequencies such as the 600khz frequency of t his design, internal circuit l imitations of the BD9E151NUX limit the practical maximum crossover frequency to about 30khz. in general, the crossover f requency should be higher than the corner frequency determined by the load impedance and the output capacitor. this limits the minimum capacitor value for the output filter to: where: rl is the output load resist ance and fc_max is the maximum crossover frequency. the output ripple voltage can be estimated by: please design in a way that it i s held within capacity ripple v oltage. in the BD9E151NUX, it is recommen ded a ceramic capac itor more than 10 f. (3) output voltage setting error amp internal standard voltage is 1.0v. output voltage is determined as seen in (5) formula (4) bootstrap capacitor please connect from 0.047f to 0. 47f (laminate ceramic capacit or) between bst pin and lx pin. i l figure 25. output voltage setting vref 1.0 v vout error amp r1 r2 fb ??? (1) ??? (2) ??? (3) ??? (4) ??? (5) figure 24. inductor current 2 Sil iout ipeak + = Sil l vin-vout = vin vout f 1 cout_min 2 rlf c _max 1 = vpp 2 fcout 1 = Sil r esr Sil + r2 r1+r2 vout = http://
12/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 ) vcc vout (1 vcc vout iout i cvcc ? = 2 iout i cvcc_max = ? ? ? ? ? ? =? vcc vout -1 vcc vout cvccf iout vcc (5) soft start function it is highly recommended to program the soft start time externally to prevent high inrush current because no soft start time is implemented internally. a capacitor (css) connected between the ss pin and ground implements a soft start time. the BD9E151NUX has an internal pull-up current source of 2ua that charges the external soft start capacitor. the equation fo r the soft start time (10% to 90 %) is shown in below equation. the iss current is 2ua. (6) catch diode the BD9E151NUX is designed to operate using an external catch diode between lx and gnd. the selected diode must meet the absolute maximum ratings for the application: rev erse voltage must be higher than the maximum voltage at the lx pin, which is vinmax + 0.5 v. peak current must be gr eater than ioutmax+ S il plus on half the peak to peak inductor current. forward voltage drop should be small for higher efficiencies. it is important to note that the catch diode conduction time is typically longer than the high-side fet on time, so attention paid to diode parameters can make a marked improvement in overall efficiency. additionally, check that the device chosen is capable of dissipating the power losses. (7) input capacitor the BD9E151NUX requires an input capacitor and depending on the application. use low esr capacitors for the best performance. ceramic capacitors ar e preferred, but low-esr elec trolytic capacitors may also suffice. the typical recommended value for the decoupling capacitor is 10uf. please place this capacitor as possible as close to the vin pin. when using ceramic capacitors, m ake sure that they have enough capacitance to provide sufficient charge to prevent excessive voltage ripple at inpu t. the input voltage ripple cau sed by capacitance can be estimated by: since the input capacitor (cvin ) absorbs the input switching cu rrent it requires an adequate ripple current rating. the rms current in the input capac itor can be estimated by: the worst case condition occurs at vin= 2vout, where (8) about adjustment of dc/dc com parator frequency characteris tics role of phase compensation elem ent c1, c2, r3 (see p.8 example of reference application circuit) stability and responsiveness o f loop are controlled through v c pin which is the output of error amp. the combination of zero and pole that determines stability and responsiveness is adjusted by the combination of resistor and capacitor that are connected in series to the vc p in. dc gain of voltage return loop c an be calculated for using the following formula. here, vfb is feedba ck voltage (1.0v).a ea is voltage gain of error amplifier (typ : 60 db), gcs is the trans-conductance of current detect (typ : 10a/v), and rl is the output loa d resistance value. figure 26. soft start time setting ??? (6) ??? (8) ??? ( ) ??? (7) ??? (10) t ss i ss c ss 0.1 = http://
13/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 gcs gea fc cout 2 = vfb vout r3 there are 2 important poles i n the control l oop of this dc/d c. the first occurs with through t he output resistance of phase co mpensation capacitor (c1) and error amplifier. the other one occurs with through the output capacitor and l oad resistor. these poles appear in the frequency written below. here, g ea is the trans-conductance of erro r amplifier (typ : 250ua/v). here, in this control loop, one zero becomes important. with the zero which occurs becaus e of phase compensation capaci tor c1 and phase compen sation resistor r3, the frequency below appears. also, if output capacitor is big , and that esr (resr) is big, i n this control loop, there are cases when it has an important, separate zero (esr zero). this esr zero occurs due to esr of output capacitor and capacit ance, and exists in the frequency below. (esr zero) in this case, the 3 rd pole determine d with the 2 nd phase compensation capacitor (c 2) and phase correction resisto r (r3) is used in order to correct the esr zero results in loop g ain. this pole exists in t he frequency shown below. (pole that corrects esr zero) the target of phase compensation design is to create a communic ation function in order to acquire necessary band and phase margin. cross-over frequency (band) at w hich loop gain of return loop becomes 0 is important. when cross-over frequency becomes low, power supply fluctuation response, load response, etc worsens. on the other hand, when cross-over frequency is too high, insta bility of the loo p can occur. tentatively, cross-over frequen cy is targeted to be made 1/20 o r below of switching frequency. selection method of phase compensation constant is shown below. 1. phase compensation resistor (r 3) is selected in order to set to the desired cross-over frequency. calculation of rc is done using the formula below. here, fc is the desired cross-ov er frequency. it is made about 1/20 and below of the normal switching frequency (fs). 2. phase compensation capacitor (c 1) is selected in order to achie ve the desired phase margin. in an application that has a rep resentative inductance value (a bout several 10uh22uh), by matching zero of compensation to 1 /4 and below of the cross-over frequency, suff icient phase margin can be acquired.c1 can be calculated using the following formula. rc is phase compensation resistor. ??? (11) ??? (12) ??? (13) ??? (14) ??? (15) ??? (16) ??? (17) http://
14/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 reset bstuvlo vf vout vin + + 3. examination whether t he second phase compens ation capacitor c2 is necessary or not is done. if the esr zero of output capacitor exists in a p lace that is s maller than half of the switching frequency, a second phase compensation capacitor is necessary. in other words, it i s the case wherein the formula below happens. in this case, add the second phas e compensation capacitor c2, and match the frequency o f the third pole to the frequency fp3 of esr zero. c2 is looked for using the following formula. output voltage restriction BD9E151NUX have a function of bstuvlo to prevent malfunction at low voltage between bst and lx. therefore output voltage is restricted by bstuvlo and max duty cycle (min 85 %). restriction by bst-uvlo when the voltage between bst and lx is lower than 2.5v, high-si de fet will be made turned off and the charge will provide from vin to bst directl y to reset bstuvlo (path). the below formula is needed to be satisfied to reset bstuvlo. here, bstuvlo reset: bstuvlo res et voltage, vf: the diode forwa rd bias voltage between vin and bst considering the fluctuation o f bstuvlo reset voltage and vf, ma ximum voltage is more than 5v. therefore maximum output voltage is defined as vin - 5v. restriction by max duty cycle maximum output voltage is restr icted by max duty cycle (min85%) . in this time it is needed to consi der the effect of nchfet ron , output current and forward vo ltage of sbd. output voltage can be calculated using the following formula. considering the effect of catch diode type and the loss by indu ctor, vomax = (vin-roniomax) 0.85 (casually formula) considering the negative voltage in the case of pulling diode c urrent, maximum voltage is m ore than vin0.7. therefore maximum output voltage is defined as vin0.7. considering above restriction , adopt the lower output voltage a s maximum voltage ??? (18) ??? (19) ??? ( 20) figure 27. bst charge pass ??? (21) :-:|:?:?:?:?:?:? (vin - ron ; :?:|:?:?:?; :?:?:?:?:w:?:w:-:?; :?:?:?:? = :?:?:?:- :?:a:?:?:-::| :?:a:? :-:?: :: http://
15/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 catch diode output capacitor softstart capacitor thermal via signal via top side ground area vout lx vcc cautions on pcb board layout layout is a critical portion of good power supply design. there are several signals paths t hat conduct fast changing currents or voltages that can interact with stray inductance or parasiti c capacitance to generate noise or degrade the power supplies performance. to help eliminate t hese problems, the vin pin shou ld be bypassed to ground with a low esr ceramic bypass capacitor with b dielectric. care should be taken to minimize the loop area formed by the bypass capacitor connections, the vin pin, and the anode of the catch diode. see fig.28 for a pcb layout example. in the BD9E151NUX, since the lx connection is the switching nod e, the catch diode and output inductor should be located close to the lx pins, and the ar ea of the pcb conductor minimiz ed to prevent excessive capacit ive coupling. and gnd area should not be connected direct ly power gnd, connected avoiding the high current switch paths . the additional external components can be placed approximately as shown. figure 28. reference pcb layout http://
16/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 power dissipation it is shown below reduc ing characteristics of power dissipation to mount 70mm70mm1.6mm t pcb junction temperature must be designed not to exceed 150. power dissipation estimate the following formulas show how to estimate the device power dissipation under continuous mode operations. they should not be used if the device is working in the discontinuous conductio n mode. the device power dissipation includes: 1) conduction loss pcon = iout 2 ronh vout/vin 2) switching loss : psw = 0.25 10 C9 vin 2 iout fsw 3) gate charge loss pgc = 22.8 10 C9 fsw 4) quiescent current l oss pq = 0.7 10 C3 vin where: iout is the output current (a, r onh is the on-re sistance of th e high-side mosfet?, vout is the output voltage (v). vin is the input voltage (v), fs w is the switch ing frequency (h z). therefore power dissipation of ic is the sum of above dissipation. pd = pcon + psw + pgc + pq for given tj, tj =ta + ja pd where: pd is the total device power dissipation (w), ta is the ambient temperature () tj is the junction temperature ( ), ja is the t hermal resistan ce of the package () 0 0.5 1 1.5 2 2.5 0 25 50 75 100 125 power dissipation [w] ambient temperature [ ] 0.412 figure 29. power dissipation ( 70mm 70mm 1.6mm t 1layer pcb) vson008x2030 package on 70mm70mm1.6mm t glass epoxy pcb 1-layer board (backside copper foil area 15mm 15mm) 4-layer board (backside copper foil area 70mm 70mm) http://
17/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 i/o equivalent circuit pin. no pin name pin equivalent circuit pin. no pin name pin equivalent circuit 1 2 7 8 bst vin gnd lx 5 fb 3 en 6 vc vc gnd 4 ss bst vc lx gnd en gnd fb gnd http://
18/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 out p ut vcc avoi d r ever se cur r ent di ode bypass di ode par as i t i c el ement resi st or p- s ubs t r at e (pi n a) npn t ransi st or (pi n b) vcc p- subs t r at e par as i t i c el ement (pi n a) par asi t i c el ement (pi n b) par asi t i c el ement notes for use (1) about absolute maximum rating when the absolute maximum ratings of application voltage, opera ting temperature range, etc. was exceeded, there is possibility of deterioration and destruction. also, the short m ode or open mode, etc. destruction condition cannot be assumed. when the special mode w here absolute maximum rating is exceeded is assumed, please give consideration to the physical safety counterm easure for the fuse, etc. (2) about gnd electric potential in every state, please make the electric potential of gnd pin into the minimum electrical potential. also, include the actual excessive effect, and plea se do it such that the pins, e xcluding the gnd pin do not become the voltage below gnd. (3) about heat design consider the power dissipation (pd) in actual state of use, and please make heat design with sufficient margin. (4) about short circuit between pins and erroneous mounting when installing to set board, please be mindful of the directio n of the ic, phase difference, etc. if it is not installed correctly, there is a chance that the ic will be destroyed. als o, if a foreign object enters the middle of output, the middle of output and power supply gnd , etc., even for t he case where it is shorted, there is a change of destruction. (5) about the operation inside a strong electro-magnetic field when using in side a strong electro-mag netic field, there is a p ossibility of error, so please be careful. (6) temperature protec t circuit (tsd circuit) temperature protect circuit (tsd circuit) is built-in in this i c. as for the temperature pr otect circuit (tsd circuit), because it a circuit that aims to block the ic from insistent c areless runs, it is not aimed for protection and guarantee of ic. therefore, please do not assu me the continuing use after operation of this circuit and the temperature protect circuit operation. (7) about checking with set boards when doing examination with the set board, during connection of capacitor to the pi n that has low impedance, there is a possibility of stress in the ic, so for every 1 process, please make sure to do electric discharge. as a countermeasure for static electricity, in the process of assembly, do groundin g, and when transporting or storing please be careful. also, when doing connection to the jig in the examination process, pl ease make sure to turn off the power supply, then connect. after that, turn off the power supply then take it off . (8) about common impedance for the power supply and the wire of gnd, lower the common impe dance, then, as much as possible, make the ripple smaller (as much as possible make the wire thick and short, and lower the ripple from l?c), etc. then and please consider it sufficiently. (9) in the application, when the mode where the vin and each pi n electrical potential becomes r eversed exists, there is a possibility that the internal circuit will become damaged. for example, during cases wherei n the condition when charge was given in the external capacit or, and the vin was shorted t o gnd, it is recomme nded to insert the bypass diode to the diode of the back current prevention in the vin series or t he middle of each pin-vin (fig.30) . (10) about ic pin input this ic is a monolithic ic, and between each element, it has p + isolation for element separation and p board. with the n layer of each element and this , the p-n junction is formed, and the parasitic element o f each type is composed. for example, like the fig.31, when resistor and transistor is c onnected to pin, when gnd(pina) in resistor, w hen gnd(pina), when gnd(pinb) in transistor (npn), the p-n junction will operat e as a parasitic diode. also, during gnd(pin b) in t he transistor (npn), through the n layer of the other e lements connected to the above-mentioned parasitic diode , the parasitic npn transistor will operation. on the composition of ic, depending on the electrical potential , the parasitic element will become necessary. through the operation of the parasitic ele ment interference of circuit operation will arouse, and error, therefore destruction can be caused. therefore please be careful about the applying of volta ge lower than the gnd (p board) in i/o pin, and the way of using when parasitic element operating. figure 31. example of simple structure of monolithic ic figure 30. example of insert diode http://
19/19 BD9E151NUX tsz02210-0q3q0az00160-1-2 ? 2013 rohm co., ltd. all rights reserved 2013.07.17 rev.001 datasheet datasheet www.rohm.com tsz22111 ? 15? 001 physical dimension tape and reel information b d 9 e 1 5 1 n u x - tr part numbe r package nux: vson008x2030 packaging and forming specification tr: embossed tape and reel marking diagram ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 4000pcs tr () direction of feed reel 1pin (unit : mm) vson008x2030 5 1 8 4 1.40.1 0.25 1.50.1 0.5 0.30.1 0.25 +0.05 ?0.04 c0.25 0.6max (0.12) 0.02 +0.03 ?0.02 3.00.1 2.00.1 1pin mark 0.08 s s vson008x2030 (top view) 151 part number marking lot number 1pin mark d9e http://
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification http://
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. http://
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. http://

▲Up To Search▲

Price & Availability of BD9E151NUX

	To Download BD9E151NUX Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .